代表性论文
J. H. Zhang, Y. H .Zhao#, X. J.Wang*, S.S.Cai*, C. Liu, J.B.Peng, etc.Microstructures and shear properties of antimony and indium strengthened Sn5Bi/Cu joints , Advanced Composites and Hybrid Materials(2024)
L. Li, S.S. Cai#, X. J. Wang*, R.Y. Ma* et al. Electrochemical noise analysis of corrosion sensitivity of Pb‑free solders in 5 wt% citric acid solution, Advanced Composites and Hybrid Materials(2024) 7:42, https://doi.org/10.1007/s42114-024-00856-z
Q.Z. Li, M.C.Li#, X. J.Wang* S.S. Cai*, J.B. Peng, S.J. Chen, J.J.Wang, X.H. Yuan. Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging, Acta Metallurgica Sinica(English Letters),2024 doi:10.1007/s40195-024-01691-3.
Q. Wang; S.S. Cai; S. Yang; Y.J. Yu; Y.K.Wan; J.B.Peng; J. J. Wang; X. J. Wang*, Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints, Journal of Materials Science: Materials in Electronics, (2024)35:576.
C.M. Li, S.J. Chen, S.S. Cai, J.B. Peng,X. J. Wang*, Y.W.Wang, microstructure and shear properties evolution of Mn doped SAC solder joint under isothermal aging,l, Journal of Iron and Steel Research International,30 (2023) 1650-1660.
C. Liu, J.B. Peng, J.T. Hu, S.S. Cai*,X. J. Wang*, Effects of phosphorus and germanium on oxidation microstructure of Sn-0.7Cu lead-free solders,J Mater Sci: Mater Electron, 2023
J.J. Wang, J.B. Peng, S.S.Cai* , X. J. Wang*，The effect of solvents on thermal stability of solder pastes in reflow process，J Mater Sci,2023
Xiaobin Luo, Jubo Peng, Weibin Zhang, Shuai Wang, Shanshan Cai*, Xiaojing Wang*，CALPHAD-guided alloy design of Sn–in based solder joints with multiphase structure and their mechanical properties (2)[J]. Materials Science & Engineering A, 2022,860:144284
Z.F. Ding, X.J. Wang* , W.D.Wang, S.S.Cai, J.D. Guo, Q.S. Zhu*, Severe embrittlement of copper pillar bumps electrodeposited using JGB as leveler，J Mater Sci: Mater Electron (2022) 33:19026–19035
刘晨，蔡珊珊，罗晓斌，彭巨擘，于智奇，王小京*，Sn-Bi二元合金应变速率敏感性的研究[J]. 电子元件与材料, 2022,41(07):763-769.
Xiaojing Wang*, Yanjie Liu, Ning Liu*, Jiacheng Fan1, Muye Niu, Yanxin Qiao, Bin Liu，Laser assisted Al0.1CoCrFeNi High Entropy Alloy Coating: Microstructures and Properties，Int. J. Electrochem. Sci., 17 (2022) Article Number: xx, doi: 10.20964/
Sen-Ming Xue, Shiqi Zhou, Xiaojing Wang*, Xiang-Hao Zeng, Zhi-Quan Liu，Microstructure coarsening of high-temperature Sn-Pb solder joint in IGBT modules of high-speed trains: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)[C], 10-13 Aug. 2022.
S.S. Cai, X.B. Luo, J.B. Peng, Z.Q. Yu, H.L. Zhou, N. Liu, X.J. Wang*, Study of deformation mechanism of various Sn-xBi alloys under tensile tests, Adv Compos Hybrid Mater,2021. 4(2): p. 379-391
Y. k. Ma, Y. Zhang, M. Liu, T. L. Han, Y. L.Wang*, X. J. Wang*, Improving the performance of quantum dot sensitized solar cells by employing Zn doped CuInS2 quantum dots, Adv Compos Hybrid Mater,2021. https://doi.org/10.1007/s42114-021-00324-y
M. Liu, Y. Ding, L.G. Wang, Y.L. Wang*, X.J. Wang*, Band structure, photoelectric properties, and electronic transition mechanism of CuGa1‑xTixS2 compound synthesized by solid‑state reaction sintering method, Adv Compos Hybrid Mater, 2021, https://doi.org/10.1007/s42114-021-00315-z
X. L.Wu, J.W. Wu, X. J. Wang*, J. Yang, M. Xia, B. Liu, Effect of In additon on microstructure and mechnical properties of Sn-40Bi alloys. Journal of Materials Science. 2019, 55(7) 3092-3106.
S.J. Li, Q.S. Zhu, B.D. Zheng,J. Yuan, X. J. Wang*, Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition, Materials Science and Engineering A. 2019, 758, 1-6.
X. L.Wu, M. Xia, S. J. li, X. J. Wang*, B. Liu, J.X. Zhang, N. Liu*, Microstructure and mechanical behavior of Sn-40Bi-xCu alloy, J Mater Sci: Mater Electron, 2017, DOI 10.1007/s10854-017-7464-7
Y. X. Chen, X. L. Wu, X. J. Wang, H. Huang, Effects of reflow time on the interfacial microstructure and shear behaviour of SAC/FeNi-Cu joint, Metals, 2016, 6 (5) :109
N. Liu*, P. H. W, P. J. Zhou, Z. Peng, X. J. Wang*, Y. P. Lu, Rapid solidification and liquid-phaseseparation of undercooled CoCrCuFexNi alloys, Intermetallics，2016, 72: 44 - 52
S.Tian, F.J. Wang*, X.J. Wang, D.Y. Li, Rapid microstructure evolution of structural composite solder joints induced by low-density current stressing,Mater. Lett. 172 (2016) 153-156
X. J. Wang*, N. Liu, S. Shi, Y. X. Chen，XPS Depth Study on the Liquid Oxidation of Sn-Bi-Zn-X(Al/P) Alloy and the Effect of Al/P on the Film，Adv. Mater. Sci. Eng., 2015(5):1-10.
X. J. Wang*，Y. X. Chen，Preparation and characterization of CdxZn1-xS thin films by chemical bath deposition，Mater. Res.Innov., 2015,19(S5):208-211.
P.H. Wu, Z. Peng, N. Liu* , M.Y. Niu, Z.X. Zhu, X.J. Wang*, The Effect of Mn Content on the Microstructure and Properties of CoCrCu0.1Fe0.15Mo1.5MnxNi Near Equiatomic Alloys, Materials Transactions, 2015 , 57 (1)
X. J. Wang*, Q. S. Zhu, B. Liu, N. Liu, F. J. Wang, Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder, J Mater Sci: Mater Electron, 2014(5):2297-2304.
X. J. Wang*, Y. L. Wang，F. J. Wang，N. Liu，J. X. Wang， Effects of Zn, Zn and Al/P additions on the comprehensive properties of Sn-Bi solder, Acta Metall. Sin. (Engl. Lett.), 2014, 27(6): 1159-1164.
X. J. Wang*，T. Y. Li, Y. X. Chen，J. X. Wang，Current induced interfacial microstructure and strength weakening of SAC/FeNi-Cu connection，Appl. Mechan. Mater., 2014, 651-653(1):11-15.
W. Yao, Y.L. Wang*, X.J. Wang, J. Zhu, Z.F. Zhang , X.J. Yuan, CuInS2 thin films obtained by solid-state sulfurization, Materials Science in Semiconductor Processing 26 (2014) 175-181.
W. Yao, Y. L. Wang*, L.G. Wang, X.J.Wang, Z.F. Zhang, Characterization and preparation of Cu2ZnSnS4 thin films by ball-milling, coating and sintering, Materials Letters, 134 (2014) 168-171
X. J. Wang, Q.L. Zeng, Q. S. Zhu, Z. G. Wang, J. K. Shang*, Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints, J. Mater. Sci. Technol.,2010, 26(8):737-742.
王小京，祝清省，王中光，尚建库*，Ag3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变的影响, 2009.08. 金属学报2009, 45(8):912-918.