材料科学与工程学院
通讯地址：
个人邮箱：wangl_ray@just.edu.cn
邮政编码：212003
办公地点：新实验楼215/长山校区418
传真：
1.主要研究方向：集成电路铜互连界面扩散；陶瓷氧化膜表面改性；陶瓷材料机械性能研究；2. Applied Surface Science、Materials Chemistry and Physics和Coatings等学术期刊上发表SCI/EI论文发表超过20余篇SCI论文。3. 主持国家自然科学基金青年基金项目一项、江苏省自然科学基金青年基金项目一项，中国博士后基金A类一项、江苏省博士后基金项目一项，主要参与国家自然科学基金和省部级科研项目十余项。4.致力于铜互连金属材料界面扩散，金属/陶瓷材料强韧化机理，塑性变形工艺，热处理工艺以及新型成形成性技术研究。
1）长期从事铜互连结构界面扩散方面的研究。在阻挡层多层膜材料、铜合金材料制备，物性表征及理论研究方面具有多年的工作经验。主要研究课题为热/电场服役环境铜互连多层异质结构界面扩散行为研究，对铜互连多层膜结构制备以及原子迁移扩散行为有系统深入的研究。
2）纳米氧化锆齿科功能材料力学性能研究，主要关注材料纳米压痕尺度效应
中国博士后基金资助项目面上资助一等，2016M602983，“水基电泳纳米义齿修复生物陶瓷增韧机制研究”，2017.1-2019.12，8万，在研，主持。
江苏省博士后基金资助项目A类，1601047A，“水基电泳纳米义齿修复生物陶瓷表面/梯度改性机制及工艺研究”，2016.9-2018.9，6万元，在研，主持。
国家自然科学基金青年项目,51501074，“热/电多场对自组装阻挡层铜互连结构界面扩散的影响机制”，2016/01-2018/12，21万元，在研，主持。
江苏省自然科学基金青年项目，BK20130468，“热/电场耦合对铜互连多层膜界面扩散的影响机制”，2013.7-2016.6，20万元，结题，主持。
Wang, Lei#, Xu Jun Hua, Yu Li Hua, Effect of electric field intensity on atom diffusion in Cu/Ta/Si stacks. In: TMS2015 Supplemental Proceedings, The Minerals, Metals & Materials Society, Wiley,
Hu, Kun, Cao, Zhen Hua, Wang, Lei, She, Qian Wei and Meng, Xiang Kang#, Annealing improved ductility and fracture toughness of nanocrystalline Cu films on flexible substrates, Journal of Physics D: Applied Physics, 2012, 45, 375305
Cao, Zhen Hua, Li, Pin Yun, Wang, Lei, Jiang, Zhao Hao and Meng, Xiang Kang#, A crossover from hardening to softening in nanocrystalline Ni by annealing and rolling, Applied Physics A, 2012, 109, 613-619
Cao, Zhen Hua, Wang, Lei, Hu, Kun, Huang, Yong Li. and Meng, Xiang Kang#, Microstructural evolution and its influence on creep and stress relaxation in nanocrystalline Ni, Acta Materialia, 2012, 60, 6742-6754
Wang, Lei#, Asempah, Isaac, Dong, Song-Tao, Yin, Pian-Pian, Jin, Lei#. Quantitative studies of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing. Applied Surface Science, 2017 399, 215-219
Wang, Lei#, Jin Lei, Yu Li Hua, Dong Song Tao, Chen Jian, Xu Jun Hua#. Evaluation of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing. Applied Physics A, 2015 122(1)
Wang, Lei#, Cao, Zhen Hua, Xu Jun Hua, Yu Li Hua, Huang Ting and Meng, Xiang Kang#, Influence of Electric Field Annealing on Atom Diffusion in Cu/Ta/Si Stacks, Applied Physics A, 2014, 114, 1092-1095
Wang, Lei, Cao, Zhen Hua, Syed, Junaid Ali, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Electric Field Accelerating Interface Diffusion in Cu/Ru/TaN/Si Stacks during Annealing, Electrochemical and Solid-State Letters, 2012, 15, H188-H191
Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Improved diffusion barrier performance of Ru/TaN bilayer by N effusion in TaN underlayer, Materials Chemistry and Physics, 2012, 135, 806-809
Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Effects of electric field annealing on the interface diffusion of Cu/Ta/Si stacks, Applied Surface Science, 2011, 257, 10845-10849
中国博士后基金资助项目面上资助一等，2016M602983，“水基电泳纳米义齿修复生物陶瓷增韧机制研究”，2017.1-2019.12，8万，在研，主持。
江苏省博士后基金资助项目A类，1601047A，“水基电泳纳米义齿修复生物陶瓷表面/梯度改性机制及工艺研究”，2016.9-2018.9，6万元，在研，主持。
国家自然科学基金青年项目,51501074，“热/电多场对自组装阻挡层铜互连结构界面扩散的影响机制”，2016/01-2018/12，21万元，在研，主持。
江苏省自然科学基金青年项目，BK20130468，“热/电场耦合对铜互连多层膜界面扩散的影响机制”，2013.7-2016.6，20万元，结题，主持。
Wang, Lei#, Xu Jun Hua, Yu Li Hua, Effect of electric field intensity on atom diffusion in Cu/Ta/Si stacks. In: TMS2015 Supplemental Proceedings, The Minerals, Metals & Materials Society, Wiley,
Hu, Kun, Cao, Zhen Hua, Wang, Lei, She, Qian Wei and Meng, Xiang Kang#, Annealing improved ductility and fracture toughness of nanocrystalline Cu films on flexible substrates, Journal of Physics D: Applied Physics, 2012, 45, 375305
Cao, Zhen Hua, Li, Pin Yun, Wang, Lei, Jiang, Zhao Hao and Meng, Xiang Kang#, A crossover from hardening to softening in nanocrystalline Ni by annealing and rolling, Applied Physics A, 2012, 109, 613-619
Cao, Zhen Hua, Wang, Lei, Hu, Kun, Huang, Yong Li. and Meng, Xiang Kang#, Microstructural evolution and its influence on creep and stress relaxation in nanocrystalline Ni, Acta Materialia, 2012, 60, 6742-6754
Wang, Lei#, Asempah, Isaac, Dong, Song-Tao, Yin, Pian-Pian, Jin, Lei#. Quantitative studies of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing. Applied Surface Science, 2017 399, 215-219
Wang, Lei#, Jin Lei, Yu Li Hua, Dong Song Tao, Chen Jian, Xu Jun Hua#. Evaluation of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing. Applied Physics A, 2015 122(1)
Wang, Lei#, Cao, Zhen Hua, Xu Jun Hua, Yu Li Hua, Huang Ting and Meng, Xiang Kang#, Influence of Electric Field Annealing on Atom Diffusion in Cu/Ta/Si Stacks, Applied Physics A, 2014, 114, 1092-1095
Wang, Lei, Cao, Zhen Hua, Syed, Junaid Ali, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Electric Field Accelerating Interface Diffusion in Cu/Ru/TaN/Si Stacks during Annealing, Electrochemical and Solid-State Letters, 2012, 15, H188-H191
Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Improved diffusion barrier performance of Ru/TaN bilayer by N effusion in TaN underlayer, Materials Chemistry and Physics, 2012, 135, 806-809
Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Effects of electric field annealing on the interface diffusion of Cu/Ta/Si stacks, Applied Surface Science, 2011, 257, 10845-10849
中国博士后基金资助项目面上资助一等，2016M602983，“水基电泳纳米义齿修复生物陶瓷增韧机制研究”，2017.1-2019.12，8万，在研，主持。
江苏省博士后基金资助项目A类，1601047A，“水基电泳纳米义齿修复生物陶瓷表面/梯度改性机制及工艺研究”，2016.9-2018.9，6万元，在研，主持。
国家自然科学基金青年项目,51501074，“热/电多场对自组装阻挡层铜互连结构界面扩散的影响机制”，2016/01-2018/12，21万元，在研，主持。
江苏省自然科学基金青年项目，BK20130468，“热/电场耦合对铜互连多层膜界面扩散的影响机制”，2013.7-2016.6，20万元，结题，主持。
Wang, Lei#, Xu Jun Hua, Yu Li Hua, Effect of electric field intensity on atom diffusion in Cu/Ta/Si stacks. In: TMS2015 Supplemental Proceedings, The Minerals, Metals & Materials Society, Wiley,
Hu, Kun, Cao, Zhen Hua, Wang, Lei, She, Qian Wei and Meng, Xiang Kang#, Annealing improved ductility and fracture toughness of nanocrystalline Cu films on flexible substrates, Journal of Physics D: Applied Physics, 2012, 45, 375305
Cao, Zhen Hua, Li, Pin Yun, Wang, Lei, Jiang, Zhao Hao and Meng, Xiang Kang#, A crossover from hardening to softening in nanocrystalline Ni by annealing and rolling, Applied Physics A, 2012, 109, 613-619
Cao, Zhen Hua, Wang, Lei, Hu, Kun, Huang, Yong Li. and Meng, Xiang Kang#, Microstructural evolution and its influence on creep and stress relaxation in nanocrystalline Ni, Acta Materialia, 2012, 60, 6742-6754
Wang, Lei#, Asempah, Isaac, Dong, Song-Tao, Yin, Pian-Pian, Jin, Lei#. Quantitative studies of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing. Applied Surface Science, 2017 399, 215-219
Wang, Lei#, Jin Lei, Yu Li Hua, Dong Song Tao, Chen Jian, Xu Jun Hua#. Evaluation of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing. Applied Physics A, 2015 122(1)
Wang, Lei#, Cao, Zhen Hua, Xu Jun Hua, Yu Li Hua, Huang Ting and Meng, Xiang Kang#, Influence of Electric Field Annealing on Atom Diffusion in Cu/Ta/Si Stacks, Applied Physics A, 2014, 114, 1092-1095
Wang, Lei, Cao, Zhen Hua, Syed, Junaid Ali, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Electric Field Accelerating Interface Diffusion in Cu/Ru/TaN/Si Stacks during Annealing, Electrochemical and Solid-State Letters, 2012, 15, H188-H191
Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Improved diffusion barrier performance of Ru/TaN bilayer by N effusion in TaN underlayer, Materials Chemistry and Physics, 2012, 135, 806-809
Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Effects of electric field annealing on the interface diffusion of Cu/Ta/Si stacks, Applied Surface Science, 2011, 257, 10845-10849
2012/6 - 至今，江苏科技大学，材料科学与工程学院，副教授
2015/11-至今，南京军区总医院，口腔科，博士后
2009/9 - 2012/6，南京大学，材料学，博士
2006/9 - 2009/4，江苏科技大学，材料物理，硕士，
2002/9 - 2006/7，安徽大学，材料物理与化学，学士
半导体器件物理
固体物理
热处理原理
热处理工艺与设备
学校地址：江苏省镇江市丹徒区长晖路666号
邮编：212100
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