Cheng, B., et al. (2022). "Self-Formed Diffusion Layer in Cu(Re) Alloy Film for Barrierless Copper Metallization." Coatings 12(5).

发布者：汪蕾发布时间：2026-02-27浏览次数：10

Cheng, B., et al. (2022). Self-Formed Diffusion Layer in Cu(Re) Alloy Film for Barrierless Copper Metallization. Coatings 12(5).


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