Wang, L., et al. (2024). "Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect." Coatings 14(1).

发布者：汪蕾发布时间：2026-02-27浏览次数：10

Wang, L., et al. (2024). Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect. Coatings 14(1).


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