Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Effects of electric field annealing on the interface diffusion of Cu/Ta/Si stacks, Applied Surface Science, 2011, 257, 10845-10849

发布者：汪蕾发布时间：2022-05-24浏览次数：56

Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Effects of electric field annealing on the interface diffusion of Cu/Ta/Si stacks, Applied Surface Science, 2011, 257, 10845-10849

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