期刊
Mingqing Liao*, Yuesheng Wu, Fei Zhou*, Bin Liu, Fengjiang Wang, Chao Xu*, Structural, mechanical and thermodynamic properties of Mg24RE5: A first-principles investigation. Vacumm, 2024, 228:113511. DOI: 10.1016/j.vacuum.2024.113511
Sijin Li, Junxian Zhu, Huiling Zhou, Mingqin Liao, Fengjiang Wang*, Jiang Chen. Effect of minor Zn dopant into Sn-10Bi solder on interfacial reaction and shear properties of solder on Ni/Au surface finish. Materials, 2024 (Major revision)
Jiayu Zhang, Mingqing Liao, Fengjiang Wang*. Effect of Trace Zn addition on interfacial reaction and shear properties of Sn-10Bi solder on Ni substrate. Journal of Iron and Steel Research International, 2024: https://doi.org/10.1007/s42243-024-01301-7
Fengjiang Wang, Pengcheng Lv, Jiayu Zhang. Effect of minor Sb addition on microstructure, interfacial behavior and mechanical properties of Sn-15Bi solder joints. Journal of Materials Science: Materials in Electronics, 2024, 35: 1274 https://doi.org/10.1007/s10854-024-13013-5
Fengjiang Wang, Dapeng Yang, Guoqing Yin, Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging, Soldering & Surface Mount Technology, 2024: https://doi.org/10.1108/SSMT-10-2023-0058
王凤江*, 董传淇. SnAgCu/SnBi混装焊点的热循环可靠性研究. 江苏科技大学学报(自然科学版), 2024, 38: 31-35
王小伟, 王凤江*. Sn-58Bi微焊点组织与力学性能的尺寸效应行为. 焊接学报，2023, 44: 70
Jiawei Chen, Mingqing Liao, Fengjiang Wang*. In or Ni addition on mechanical properties and interfacial growth in Sn–35Bi–1Ag solder joint during isothermal aging. Journal of Materials Science: Materials in Electronics, 2023, 34: 1558
Mingqing Liao, Hongshun Gong, Nan Qu, Fengjiang Wang*, Jingchuan Zhu, Zi-kui Liu. CALPHAD aided mechanical properties screening in full composition space of NbC-TiC-VC-ZrC ultra-high temperature ceramics. International Journal of Refractory Metals and Hard Materials, 2023, 113: 106191
Mingqing Liao, Jumahan Maimaitimusha, Xueting Zhang, Jingchuan Zhu and Fengjiang Wang*. P212121-C16: An ultrawide bandgap and ultrahard carbon allotrope with the bandgap larger than diamond. Frontiers of Physics, 2022, 17: 63507
杨蔚然, 季童童, 丁毓, 王凤江*. 热老化与热循环条件下Bi添加对Sn-1.0Ag-0.5Cu低银无铅焊点界面组织与性能的影响. 焊接学报，2022, 43: 157-162
Su-juan Zhong, Liang Zhang, Mu-lan Li, Wei-min Long, Fengjiang Wang, Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties. Materials & Design, 2022, 215: 110439
姜楠, 张亮, 孙磊, 王凤江, 龙伟民, 钟素娟. 热循环对Sn-58Bi-0.1Ti/Cu焊点界面与性能影响. 稀有金属材料与工程, 2022
Weiran Yang, Yu Ding, Mingqing Liao, Fengjiang Wang*. Effect of trace Ge on interfacial reaction and shear strength in Sn-0.7Cu solder joints during aging and thermal cycling. Journal of Materials Science: Materials in Electronics, 2022, 33: 17133-17151 https://doi.org/10.1007/s10854-022-08589-9
Jun Wu, Fengjiang Wang*, Kaipeng Wang. Thermomigration behavior of Sn-Bi joints under different substrate. Journal of Materials Science: Materials in Electronics, 2022, 33: 8127-8139
王凤江*,何其航. 添加微量Zn对Sn-58Bi/Cu焊点老化过程中界面演变以及力学性能的影响. 机械工程学报, 2022,58(2): 284-290
Mingqing Liao, Fengjiang Wang*, Jingchuan Zhu, Zhonghong Lai, Yong Liu. P2221-C8: A novel carbon allotrope denser than diamond. Scripta Materialia, 2022, 212: 114549
Kai Qi, Guo Xu and Fengjiang Wang*. Interfacial behavior and shear strength of Al-25Si-4Cu-1Mg joints by transient liquid phase bonding with Cu as interlayer. Metals, 2021, 11: 1637
Fengjiang Wang, Amey Luktuke, Nikhilesh Chawla*. Microstructural coarsening and mechanical properties of eutectic Sn-58Bi solder joint during aging. Journal of Electronic Materials, 2021, 50: 6607-6614
Y. Wang, Z. Rao*, S. Liao, Fengjiang Wang. Ultrasonic welding of fiber reinforced thermoplastic composites: current understanding and challenges. Composites Part A, 2021, 149: 106578
Qingfeng Wang, Yu Ding, Fengjiang Wang*. Effect of nano ZnO addition on wettability and interfacial structure of Sn-based Pb-free solders on Aluminum. Materiali in Tehnologije (Materials and Technology), 2020, 54: 79-83
Qingfeng Wang, Hong Chen, Fengjiang Wang*. Effect of trace Zn addition on the interfacial evolution in Sn-10Bi/Cu solder joints during aging. Materials, 2019, 12(24): 4240
Kaipeng Wang, Fengjiang Wang*,Ying Huang, Kai Qi. Comprehensive properties of a novel quaternary Sn-Bi-Sb-Ag solder: wettability, interfacial structure and mechanical properties. Metals, 2019, 9(7): 791
Dandan Feng, Fengjiang Wang*, Dongyang Li, Bin Wu, Luting Liu, Mingfang Wu.Atomic migration in Sn-58Bi solder from the interaction between electromigration and thermomigration. Materials Research Express, 2019, 6: 046301
Fengjiang Wang*, Yu Ding, Luting Liu, Ying Huang, Mingfang Wu. Wettability, interfacial behavior and joint properties of Sn-15Bi solder. Journal of Electronic Materials, 2019, 48(10): 6835-6848
Fengjiang Wang*, Hong Chen, Ying Huang, Luting Liu, Zhijie Zhang. Recent progress on development of Sn-Bi based low-temperature Pb-free solders. Journal of Materials Science: Materials in Electronics, 2019, 30: 3222-3243
Fengjiang Wang*, Hong Chen, Ying Huang, Chao Yan. Interfacial behaviors in Cu/molten Sn–58Bi/Cu solder joints under coupling with thermal and current stressing. Electronic Materials Letters, 2019, 15: 36-48
Fengjiang Wang*, Luting Liu, Dongyang Li, Mingfang Wu. Electromigration behaviors in Sn-58Bi solder joints under different current densities and temperatures. Journal of Materials Science: Materials in Electronics, 2018, 29: 21157-21169
Shuang Tian, Jian Zhou, Feng Xue, RuiHua Cao, Fengjiang Wang. Microstructure, interfacial reactions and mechanical properties of Co/Sn/Co and Cu/Sn/Cu joints produced by transient liquid phase bonding. Journal of Materials Science: Materials in Electronics, 2018, 29: 13688-16400
Fengjiang Wang*, Hong Chen, Ying Huang, Chao Yan. Interfacial behavior and joint strength of Sn-Bi solder with solid solution compositions. Journal of Materials Science: Materials in Electronics, 2018, 29: 11409-11420
Fengjiang Wang*, Luting Liu, Mingfang Wu, Dongyang Li. Interfacial evolution in Sn–58Bi solder joints during liquid electromigration. Journal of Materials Science: Materials in Electronics, 2018, 29: 8895-8903
Fengjiang Wang*, Dongyang Li, Shuang Tian. Electromigration Reliability of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints. Microelectronics Reliability, 2017, 73: 106-115
Fengjiang Wang*, Dongyang Li, Jiheng Wang, Xiaojing Wang, Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system, Journal of Materials Science: Materials in Electronics, 2017, 28: 1631-1643
Fengjiang Wang*, Lili Zhou. Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint. Journal of Electronic Materials, 2017, 46: 6204-6213
Fengjiang Wang*, Ying Huang, Zhijie Zhang, Chao Yan. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints. Materials, 2017, 10: 920
Fengjiang Wang*, Luting Liu, Lili Zhou, Jiheng Wang, Mingfang Wu, Xiaojing Wang. Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration. Materials Transactions, 2017, 58: 1593-1600
Fengjiang Wang*, Dongyang Li, Zhijie Zhang, Mingfang Wu, Chao Yan. Improvement on interfacial structure and properties of Sn-58Bi/Cu joint using Sn-3.0Ag-0.5Cu solder as barrier. Journal of Materials Science: Materials in Electronics, 2017, 28: 19051-19060
Shuang Tian, Saiping Li, Jiang Zhou, Feng Xue, Ruihua Cao and Fengjiang Wang. Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints. Journal of Materials Science: Materials in Electronics, 2017, 28: 16120-16132
Fengjiang Wang*, Lili Zhou, Xiaojing Wang, Peng He, Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging, Journal of Alloys and Compounds, 2016, 688: 639-648
Fengjiang Wang*, Ying Huang. Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test, Materials Science & Engineering A, 2016, 668: 224-233
Shuang Tian, Fengjiang Wang*, Xiaojing Wang, Dongyang Li, Rapid microstructure evolution of structural composite solder joints induced by low-density current stressing, Materials Letters, 2016, 172: 153-156
Fengjiang Wang, Matthew O’Keefe and Brandon Brinkmeyer. Microstructural evolution and tensile properties of SnAgCu mixed with Sn-Pb solder alloys. Journal of Alloys and Compounds, 2009, 477: 267-273
Fengjiang Wang, et al. Intermetallic compound formation at Sn-3.0Ag-0.5Cu- 1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions. Journal of Alloys and Compounds, 2007, 438: 110-115.
Wang, HQ; Wang, FJ; Gao, F, et al. Reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate. Journal of Alloys and Compounds, 2007, 433: 302-305.
Fengjiang Wang, Feng Gao, Xin Ma, Yiyu Qian. Depressing effect of 0.2 wt% Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging. Journal of Electronic Materials, 2006, 35(10): 1818-1824.
Fengjiang Wang, Xin Ma and Yiyu Qian.Improvement of microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition. Scripta Materialia, 2005, 53: 699-702.
Fengjiang Wang, Xin Ma and Yiyu Qian. Rate-dependent indentation behavior of solder alloys. Journal of Materials Science, 2005, 40: 1923-1928.
Fengjiang Wang, Xin Ma andYiyu Qian.Indentation rate-dependent creep behavior of Sn-Ag-Cu Pb-free Ball grid array (BGA) solder joint. Materials Science Forums, 2005, 502: 399-404.
Xin Ma, Fengjiang Wang, Yiyu Qian and Fusahito Yoshida. Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface. Materials letters, 2003, 57: 3361-3365.
王凤江,钱乙余, 马鑫.微观压痕法测量Sn-Ag-Cu系无铅钎料的力学性能参数.中国有色金属学报, 2005, 15(5): 688-693.
王凤江, 钱乙余, 马鑫.纳米压痕法测量SnAgCu无铅钎料BGA焊点的力学性能参数. 金属学报, 2005, 41(7) : 775-779.
会议文章
Fengjiang Wang, Dongyang Li. The influence of adding different Sn-based solder coating into Sn-58Bi/Cu interface on the growth of intermetallic compound. ICEPT 2017, Aug. 16-19, Harbin, China
Fengjiang Wang, Ying Huang. The shear strength and fracture mode of Sn-xBi (x=0, 2.5, 5, 15)/Cu solder joints. ICEPT 2017, Aug. 16-19, Harbin, China
Fengjiang Wang, Zhiping Xiao. Electromigration behavior of liquid Sn-58Bi/Cu joints through minor Zn alloying substrates. ICEPT 2017, Aug. 16-19, Harbin, China
Fengjiang Wang, Matthew O’Keefe. Modeling of Pb-free BGA solder joint fatigue life during random vibration. TMS2010, Feb 14-18, 2010, Seattle, WA, USA.
Fengjiang Wang, Matthew O’Keefe. Effect of Surface Finish, Package Size, and Rework on Pb-free Solder Ball Grid Arrays during Thermal Cycling. TMS2009, Feb 15-19, San Francisco, CA, USA.
Fengjiang Wang, Matthew O’Keefe. Numerical and Experimental Analysis of Ball Grid Array Packages during Random Vibration. TMS2008, Mar 9-13, New Orleans, LA, USA.
Matthew O’Keefe, Fengjiang Wang and Brandon Brinkmeyer. Effect of Incorporating Eutectic Sn-Pb Solder on the Microstructure and Tensile Properties of SAC 305 Pb-free Solder. 2008 International Materials Research Conference, June, 9-12, 2008, Chongqing, China.
H.Q. Wang,F.J. Wang, X. Ma, J. Liu and Y.Y. Qian. Study on reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate. The 6th International Conference on Electronics Packaging Technology, August 31-September 1, 2005, Shenzhen, China.
Fengjiang Wang, Xin Ma and Yiyu Qian. Indentation rate-dependent creep behavior of Sn-Ag-Cu Pb-free Ball Grid Array (BGA) solder joint. IPC/Soldertec 2nd international conference on lead-free electronics, June 22-23, 2004, Amsterdam, Netherlands.
F.J. Wang, X. Ma, Y.Y. Qian and F. Yoshida. A study on intermetallic compound layer development at Pb-free solder/Cu joint interfaces. Proceeding of the International Conference on Designing of Interfacial Structures in Advanced Materials and their Joints, Osaka Japan, 2002: 478-483.
王凤江,钱乙余.无铅钎料/Cu界面间金属学行为研究.钎焊及特种连接会议论文集, 2002
专利
王凤江. 一种用于减少锡铋焊点金属间化合物形成的方法. 国家发明专利, 201610592181.0
王凤江. 一种凸点下金属化层构件及制备方法. 国家发明专利, 201610953957.7
吴建雄, 吴建新, 马鑫, 王凤江. 具有抗氧化能力的无铅焊料. 国家发明专利, 专利号ZL 03 1 10895.4
吴建雄, 吴建新, 王凤江, 刘军, 王宏芹. 波峰焊用无铅软钎焊料合金. 国家发明专利, 专利号ZL 03 1 11446.6