材料科学与工程学院
通讯地址:
个人邮箱:ray521252@163.com
邮政编码:212003
办公地点:新实验楼215/长山校区418
传真:
[1] J. Luan, Z. Cao, H. Lu, S. Dong, L. Wang, T. Tokoroyama, H. Ju, Silver-enhanced ZrN-MoSN composite films via magnetron sputtering: Insighting into the microstructure and optimizing self-lubricating properties, Surface and Coatings Technology, 524 (2026).通讯作者 二区
[2] X. Guo, Y. Yao, X. Sun, X. Ye, L. Jin, L. Wang, Y. Zhang, S. Dong, Microstructure modulation via ca doping enhances LaCoO3 supercapacitor electrochemical performance, Inorg Chim Acta, (2026).通讯作者 三区
[3] X. Guo, X. Sun, L. Wang, S. Dong, Y. Zhang, L. Jin, H. Ju, Sr@LCO application of double perovskite composites in supercapacitors, Chem Eng J, 527 (2026).通讯作者 一区
[4] X. Guo, Z. Tian, J. Qu, X. Ye, L. Wang, Y. Zhang, S. Dong, H. Ju, Enhanced the electrochemical performance in Sr-doped LaCoO3 nanofibers, J Alloy Compd, 1031 (2025).通讯作者 二区
[5] X. Guo, X. Sun, L. Wang, Y. Qiao, S. Dong, Investigation of the Structure and Electrochemical Performance of Perovskite Oxide La1−xCaxCrO3 Utilized as Electrode Materials for Supercapacitors, Coatings, 15 (2025).通讯作者 三区
[6] X. Guo, X. Sun, H. Ju, L. Jin, L. Wang, S. Dong, Facile synthesis of perovskite La2CoMnO6 nanoparticles for high-performance supercapacitor electrodes, Journal of Energy Storage, 130 (2025).通讯作者 二区
[7] L. Wang, X. Guo, S. Dong, Y. Qiao, J. Chen, Z. Yan, R. Shu, L. Jin, Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect, Coatings, 14 (2024).通讯作者 三区
[8] J. Zheng, H. Zhao, X. Guo, X. Jin, L. Wang, S. Dong, J. Chen, Enhanced Electrochemical Performance of LaMnO3 Nanoparticles by Ca/Sr Doping, Coatings, 14 (2023).通讯作者 三区
[9] B. Cheng, H. Chen, I. Asempah, J. Wang, Y. Zhu, J. Wan, F. Jiang, Z. Wang, Y. Shui, L. Wang, L. Jin, Y. Qiao, Self-Formed Diffusion Layer in Cu(Re) Alloy Film for Barrierless Copper Metallization, Coatings, 12 (2022).通讯作者 三区
[10] X. Li, B. Cheng, I. Asempah, Q. Shi, A.Q. Long, Y.L. Zhu, Q. Wang, Y.L. Li, L. Wang, L. Jin, Effect of Different Ni Contents on Thermal Stability of Cu(Ni) Alloy Film, J Electron Mater, 49 (2020) 5674-5680.通讯作者 三区
[11] L. Wang, I. Asempah, X. Li, S.-Q. Zang, Y.-F. Zhou, J. Ding, L. Jin, Indentation size effect in aqueous electrophoretic deposition zirconia dental ceramic, J Mater Res, 34 (2019) 555-562.通讯作者 三区
[12] L. Wang, I. Asempah, S.-T. Dong, P.-P. Yin, L. Jin, Quantitative studies of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing, Appl Surf Sci, 399 (2017) 215-219.
[13] F. Wang, D. Li, Z. Zhang, M. Wu, C. Yan, Improvement on interfacial structure and properties of Sn–58Bi/Cu joint using Sn–3.0Ag–0.5Cu solder as barrier, Journal of Materials Science: Materials in Electronics, 28 (2017) 19051-19060.
[14] L. Wang, L. Jin, L.H. Yu, S.T. Dong, J. Chen, J.H. Xu, Evaluation of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing, Appl Phys A-mater, 122 (2016) 1-5.
[15] L. Wang, J.H. Xu, L.H. Yu, S.T. Dong, Effect of Electric Field Intensity on Atom Diffusion in Cu/Ta/Si Stacks, (2015) 575-581.
[16] L. Wang, Z.H. Cao, J.H. Xu, L.H. Yu, T. Huang, X.K. Meng, Influence of electric field annealing on atom diffusion in Cu/Ta/Si stacks, Appl Phys A-mater, 114 (2014) 1091-1095.
[17] L. Wang, Z.H. Cao, J.A. Syed, K. Hu, Q.W. She, X.K. Meng, Electric Field Accelerating Interface Diffusion in Cu/Ru/TaN/Si Stacks during Annealing, Electrochem Solid-State Lett, 15 (2012) H188.
[18] L. Wang, Z.H. Cao, K. Hu, Q.W. She, X.K. Meng, Improved diffusion barrier performance of Ru/TaN bilayer by N effusion in TaN underlayer, Mater Chem Phys, 135 (2012) 806-809.
[19] L. Wang, Z.H. Cao, K. Hu, Q.W. She, X.K. Meng, Effects of electric field annealing on the interface diffusion of Cu/Ta/Si stacks, Appl Surf Sci, 257 (2011) 10845-10849.
1)长期从事铜互连结构界面扩散方面的研究。在阻挡层多层膜材料、铜合金材料制备,物性表征及理论研究方面具有多年的工作经验。主要研究课题为热/电场服役环境铜互连多层异质结构界面扩散行为研究,对铜互连多层膜结构制备以及原子迁移扩散行为有系统深入的研究。
2)纳米氧化锆齿科功能材料力学性能研究,主要关注材料纳米压痕尺度效应
3)调控钙钛矿晶体结构(如ABO₃型氧化物)优化离子/电子传输通道,开发具有高比表面积、优异电化学稳定性的电极材料,实现快速充放电与长循环寿命,适用于新能源汽车、智能电网及可穿戴设备等领域。
2012/6 - 至今,江苏科技大学,材料科学与工程学院,副教授
2015/11-至今,南京军区总医院,口腔科,博士后
2009/9 - 2012/6,南京大学,材料学,博士
2006/9 - 2009/4,江苏科技大学,材料物理,硕士,
2002/9 - 2006/7,安徽大学,材料物理与化学,学士
半导体器件物理
固体物理
热处理原理
热处理工艺与设备
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