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[5] SCI, Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method and the application [J].Ultrasonics Sonochemistry, 2016,33:10-17.(第一作者)
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[4] SCI, Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate [J].Ultrasonics Sonochemistry, 2016,(第一作者)
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[3] SCI,Reducing the internal compressive stress of the microelectroformed layer by adjusting the current densities[J]. Micro & Nano Letters,2019.(第一作者)
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[2] SCI, Effect of dislocation density on adhesion strength of electroforming Ni layer on Cu substrate [J]. Journal of Adhesion Science and Technology, 2019. (第一作者)
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[1] SCI, A new ultrasonic electrochemical potential activation method to enhance the adhesion strength between electroforming layer and Cu substrate [J]. Journal of Adhesion Science and Technology, 2021. (第一作者)
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