期刊
Junjie Zhao, Hongshun Gong, Hao Wang, Mingqin Liao, Fengjiang Wang*. Quasi-in-situ observation of microstructure evolution and growth kinetics analysis of Sn-58Bi solder under different aging conditions. Materials Characterization, 2025, 227: 115343 DOI: https://doi.org/10.1016/j.matchar.2025.115343
Qi Li, Zezheng Li, Han Yan, Zhenyi Ren, Changxun Li, Aidong Liu, Wenxuan Pang, GuanHeng Ren, Mingqing Liao, Fengjiang Wang*. Optimizing wettability of solders from surface treatment on substrate, alloying into solder, soldering flux and process environments. Materials Science in Semiconductor Processing, 2025, Revise
Han Yan, Yu Ding and Fengjiang Wang*. Enhancement on interface and shear properties of Sn-1.0Ag-0.5Cu solder joints by 0.05% Ge under isothermal aging and thermal cycling. Microelectronics Reliability, 2025: Minor Revise
Han Yan, Fengjiang Wang*. Inhibition on the growth of interfacial IMCs in Sn-15Bi molten solder with Ni or Co substrate under temperature gradient. Materials Science in Semiconductor Processing, 2025, 197: 109729
Yuehua Wang, Mingqing Liao, Nan Qu, Xizhen Li, Danni Yang, Zhonghong Lai, Yong Liu, Fengjiang Wang, Jingchuan Zhu. Machine learning assisted phase prediction of refractory multi-component alloys based on data from low-, medium-, and high-entropy alloys. International Journal of Refractory Metals and Hard Materials, 2005, 132: 107263 https://doi.org/10.1016/j.ijrmhm.2025.107263
Sijin Li, Huixuan Li, Yunhong Wang, Han Yan, Mingqing Liao, Fengjiang Wang*. Microstructure, interface and shear strength on Sn-based solder joints induced from the change on solder size. Soldering & Surface Mount Technology, 2025, https://doi.org/10.1108/SSMT-03-2025-0017
Sijin Li, Xiaowei Wang, Mingqing Liao, Zezheng Li, Qi Li, Han Yan, Aidong Liu, Fengjiang Wang*. Microstructures, mechanical properties and reliability induced from size effect in Sn-based solder joints: Review. Journal of Materials Research and Technology, 2025, 35: 5067-5083.
Junjie Zhao, Mingqing Liao*, Jiayu Zhang, Yuehua Wang, Chenggang Wu, Haoxin Jiang, Fei Zhou*, Jintong Gan, Nan Qu, Fengjiang Wang*. HM-C21: A three-dimensional carbon with abundant p-electron-induced magnetic states for spintronics. Applied Physics Letters, 2025, 126: 162402
Fengjiang Wang*, Dapeng Yang, Guoqing Yin, Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging, Soldering & Surface Mount Technology, 2025, 37, 127-138 https://doi.org/10.1108/SSMT-10-2023-0058
Han Yan, Guoqing Yin, Tongtong Ji, Mingqing Liao, Fengjiang Wang*. Microstructure and reliability of Sn15Bi-xAg solder joints on Ni and Cu substrates during thermal cycling. Materials Today Communications, 2025, 44: 111916.
Junjie Zhao, Jun Wu, Jiayu Zhang, Mingqin Liao, Fengjiang Wang*. Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue. Journal of Materials Research and Technology, 2025, 34: 1191-1200. DOI: https://doi.org/10.1016/j.jmrt.2024.12.116
Mingqing Liao*, Xiaojie Zhang, Yuesheng Wu, Fei Zhou, Danni Yang, Xiaohong Yuan, Fengjiang Wang, Chao Xu. Structural and mechanical properties of Mg-RE intermetallic compounds: high-throughput first-priciples calculations. Journal of Rare Earths, 2024, https://doi.org/10.1016/j.jre.2024.12.005
Mingqing Liao*, Yuesheng Wu, Fei Zhou*, Bin Liu, Fengjiang Wang, Chao Xu*, Structural, mechanical and thermodynamic properties of Mg24RE5: A first-principles investigation. Vacumm, 2024, 228:113511. https://doi.org/10.1016/j.vacuum.2024.113511
Sijin Li, Junxian Zhu, Huiling Zhou, Mingqin Liao, Fengjiang Wang*, Jiang Chen. Effect of minor Zn dopant into Sn-10Bi solder on interfacial reaction and shear properties of solder on Ni/Au surface finish. Materials, 2024, 17: 4364. https://doi.org/10.3390/ma17174364
Jiayu Zhang, Fengjiang Wang*, Yanxin Qiao. Effect of Trace Zn addition on electromigration of Cu/Sn-10Bi/Cu solder joints. Journal of Iron and Steel Research International, 2024, 31: 2568-2576 https://doi.org/10.1007/s42243-024-01301-7
Fengjiang Wang, Pengcheng Lv, Jiayu Zhang. Effect of minor Sb addition on microstructure, interfacial behavior and mechanical properties of Sn-15Bi solder joints. Journal of Materials Science: Materials in Electronics, 2024, 35: 1274 https://doi.org/10.1007/s10854-024-13013-5
王凤江*, 董传淇. SnAgCu/SnBi混装焊点的热循环可靠性研究. 江苏科技大学学报(自然科学版), 2024, 38: 31-35
王小伟, 王凤江*. Sn-58Bi微焊点组织与力学性能的尺寸效应行为. 焊接学报,2023, 44: 70
Jiawei Chen, Mingqing Liao, Fengjiang Wang*. In or Ni addition on mechanical properties and interfacial growth in Sn–35Bi–1Ag solder joint during isothermal aging. Journal of Materials Science: Materials in Electronics, 2023, 34: 1558
Mingqing Liao, Hongshun Gong, Nan Qu, Fengjiang Wang*, Jingchuan Zhu, Zi-kui Liu. CALPHAD aided mechanical properties screening in full composition space of NbC-TiC-VC-ZrC ultra-high temperature ceramics. International Journal of Refractory Metals and Hard Materials, 2023, 113: 106191
Mingqing Liao, Jumahan Maimaitimusha, Xueting Zhang, Jingchuan Zhu and Fengjiang Wang*. P212121-C16: An ultrawide bandgap and ultrahard carbon allotrope with the bandgap larger than diamond. Frontiers of Physics, 2022, 17: 63507
杨蔚然, 季童童, 丁毓, 王凤江*. 热老化与热循环条件下Bi添加对Sn-1.0Ag-0.5Cu低银无铅焊点界面组织与性能的影响. 焊接学报,2022, 43: 157-162
Su-juan Zhong, Liang Zhang, Mu-lan Li, Wei-min Long, Fengjiang Wang, Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties. Materials & Design, 2022, 215: 110439
姜楠, 张亮, 孙磊, 王凤江, 龙伟民, 钟素娟. 热循环对Sn-58Bi-0.1Ti/Cu焊点界面与性能影响. 稀有金属材料与工程, 2022
Weiran Yang, Yu Ding, Mingqing Liao, Fengjiang Wang*. Effect of trace Ge on interfacial reaction and shear strength in Sn-0.7Cu solder joints during aging and thermal cycling. Journal of Materials Science: Materials in Electronics, 2022, 33: 17133-17151 https://doi.org/10.1007/s10854-022-08589-9
Jun Wu, Fengjiang Wang*, Kaipeng Wang. Thermomigration behavior of Sn-Bi joints under different substrate. Journal of Materials Science: Materials in Electronics, 2022, 33: 8127-8139
王凤江*,何其航. 添加微量Zn对Sn-58Bi/Cu焊点老化过程中界面演变以及力学性能的影响. 机械工程学报, 2022,58(2): 284-290
Mingqing Liao, Fengjiang Wang*, Jingchuan Zhu, Zhonghong Lai, Yong Liu. P2221-C8: A novel carbon allotrope denser than diamond. Scripta Materialia, 2022, 212: 114549
Kai Qi, Guo Xu and Fengjiang Wang*. Interfacial behavior and shear strength of Al-25Si-4Cu-1Mg joints by transient liquid phase bonding with Cu as interlayer. Metals, 2021, 11: 1637
Fengjiang Wang, Amey Luktuke, Nikhilesh Chawla*. Microstructural coarsening and mechanical properties of eutectic Sn-58Bi solder joint during aging. Journal of Electronic Materials, 2021, 50: 6607-6614
Y. Wang, Z. Rao*, S. Liao, Fengjiang Wang. Ultrasonic welding of fiber reinforced thermoplastic composites: current understanding and challenges. Composites Part A, 2021, 149: 106578
Qingfeng Wang, Yu Ding, Fengjiang Wang*. Effect of nano ZnO addition on wettability and interfacial structure of Sn-based Pb-free solders on Aluminum. Materiali in Tehnologije (Materials and Technology), 2020, 54: 79-83
Qingfeng Wang, Hong Chen, Fengjiang Wang*. Effect of trace Zn addition on the interfacial evolution in Sn-10Bi/Cu solder joints during aging. Materials, 2019, 12(24): 4240
Kaipeng Wang, Fengjiang Wang*,Ying Huang, Kai Qi. Comprehensive properties of a novel quaternary Sn-Bi-Sb-Ag solder: wettability, interfacial structure and mechanical properties. Metals, 2019, 9(7): 791
Dandan Feng, Fengjiang Wang*, Dongyang Li, Bin Wu, Luting Liu, Mingfang Wu.Atomic migration in Sn-58Bi solder from the interaction between electromigration and thermomigration. Materials Research Express, 2019, 6: 046301
Fengjiang Wang*, Yu Ding, Luting Liu, Ying Huang, Mingfang Wu. Wettability, interfacial behavior and joint properties of Sn-15Bi solder. Journal of Electronic Materials, 2019, 48(10): 6835-6848
Fengjiang Wang*, Hong Chen, Ying Huang, Luting Liu, Zhijie Zhang. Recent progress on development of Sn-Bi based low-temperature Pb-free solders. Journal of Materials Science: Materials in Electronics, 2019, 30: 3222-3243
Fengjiang Wang*, Hong Chen, Ying Huang, Chao Yan. Interfacial behaviors in Cu/molten Sn–58Bi/Cu solder joints under coupling with thermal and current stressing. Electronic Materials Letters, 2019, 15: 36-48
Fengjiang Wang*, Luting Liu, Dongyang Li, Mingfang Wu. Electromigration behaviors in Sn-58Bi solder joints under different current densities and temperatures. Journal of Materials Science: Materials in Electronics, 2018, 29: 21157-21169
Shuang Tian, Jian Zhou, Feng Xue, RuiHua Cao, Fengjiang Wang. Microstructure, interfacial reactions and mechanical properties of Co/Sn/Co and Cu/Sn/Cu joints produced by transient liquid phase bonding. Journal of Materials Science: Materials in Electronics, 2018, 29: 13688-16400
Fengjiang Wang*, Hong Chen, Ying Huang, Chao Yan. Interfacial behavior and joint strength of Sn-Bi solder with solid solution compositions. Journal of Materials Science: Materials in Electronics, 2018, 29: 11409-11420
Fengjiang Wang*, Luting Liu, Mingfang Wu, Dongyang Li. Interfacial evolution in Sn–58Bi solder joints during liquid electromigration. Journal of Materials Science: Materials in Electronics, 2018, 29: 8895-8903
Fengjiang Wang*, Dongyang Li, Shuang Tian. Electromigration Reliability of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints. Microelectronics Reliability, 2017, 73: 106-115
Fengjiang Wang*, Dongyang Li, Jiheng Wang, Xiaojing Wang, Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system, Journal of Materials Science: Materials in Electronics, 2017, 28: 1631-1643
Fengjiang Wang*, Lili Zhou. Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint. Journal of Electronic Materials, 2017, 46: 6204-6213
Fengjiang Wang*, Ying Huang, Zhijie Zhang, Chao Yan. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints. Materials, 2017, 10: 920
Fengjiang Wang*, Luting Liu, Lili Zhou, Jiheng Wang, Mingfang Wu, Xiaojing Wang. Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration. Materials Transactions, 2017, 58: 1593-1600
Fengjiang Wang*, Dongyang Li, Zhijie Zhang, Mingfang Wu, Chao Yan. Improvement on interfacial structure and properties of Sn-58Bi/Cu joint using Sn-3.0Ag-0.5Cu solder as barrier. Journal of Materials Science: Materials in Electronics, 2017, 28: 19051-19060
Shuang Tian, Saiping Li, Jiang Zhou, Feng Xue, Ruihua Cao and Fengjiang Wang. Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints. Journal of Materials Science: Materials in Electronics, 2017, 28: 16120-16132
Fengjiang Wang*, Lili Zhou, Xiaojing Wang, Peng He, Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging, Journal of Alloys and Compounds, 2016, 688: 639-648
Fengjiang Wang*, Ying Huang. Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test, Materials Science & Engineering A, 2016, 668: 224-233
Shuang Tian, Fengjiang Wang*, Xiaojing Wang, Dongyang Li, Rapid microstructure evolution of structural composite solder joints induced by low-density current stressing, Materials Letters, 2016, 172: 153-156
Fengjiang Wang, Matthew O’Keefe and Brandon Brinkmeyer. Microstructural evolution and tensile properties of SnAgCu mixed with Sn-Pb solder alloys. Journal of Alloys and Compounds, 2009, 477: 267-273
Fengjiang Wang, et al. Intermetallic compound formation at Sn-3.0Ag-0.5Cu- 1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions. Journal of Alloys and Compounds, 2007, 438: 110-115.
Wang, HQ; Wang, FJ; Gao, F, et al. Reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate. Journal of Alloys and Compounds, 2007, 433: 302-305.
Fengjiang Wang, Feng Gao, Xin Ma, Yiyu Qian. Depressing effect of 0.2 wt% Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging. Journal of Electronic Materials, 2006, 35(10): 1818-1824.
Fengjiang Wang, Xin Ma and Yiyu Qian.Improvement of microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition. Scripta Materialia, 2005, 53: 699-702.
Fengjiang Wang, Xin Ma and Yiyu Qian. Rate-dependent indentation behavior of solder alloys. Journal of Materials Science, 2005, 40: 1923-1928.
Fengjiang Wang, Xin Ma andYiyu Qian.Indentation rate-dependent creep behavior of Sn-Ag-Cu Pb-free Ball grid array (BGA) solder joint. Materials Science Forums, 2005, 502: 399-404.
Xin Ma, Fengjiang Wang, Yiyu Qian and Fusahito Yoshida. Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface. Materials letters, 2003, 57: 3361-3365.
王凤江,钱乙余, 马鑫.微观压痕法测量Sn-Ag-Cu系无铅钎料的力学性能参数.中国有色金属学报, 2005, 15(5): 688-693.
王凤江, 钱乙余, 马鑫.纳米压痕法测量SnAgCu无铅钎料BGA焊点的力学性能参数. 金属学报, 2005, 41(7) : 775-779.
会议文章与报告
主题报告:Novel minor Zn-contained solders for intreconnected application. 2024国际钎焊、扩散焊及微纳连接会议(2024 International Conference on Brazing, Diffusion Bonding and Micro-Nano Joing, BDB-MNJ2024),浙江杭州,2024.10.20-23
特邀报告:Sn-58Bi低温钎料的组织演变及其相场模拟. 异质材料焊接与连接第四届学术会议, 重庆市, 2024.4.24-4.26
Fengjiang Wang, Dongyang Li. The influence of adding different Sn-based solder coating into Sn-58Bi/Cu interface on the growth of intermetallic compound. ICEPT 2017, Aug. 16-19, Harbin, China
Fengjiang Wang, Ying Huang. The shear strength and fracture mode of Sn-xBi (x=0, 2.5, 5, 15)/Cu solder joints. ICEPT 2017, Aug. 16-19, Harbin, China
Fengjiang Wang, Zhiping Xiao. Electromigration behavior of liquid Sn-58Bi/Cu joints through minor Zn alloying substrates. ICEPT 2017, Aug. 16-19, Harbin, China
Fengjiang Wang, Matthew O’Keefe. Modeling of Pb-free BGA solder joint fatigue life during random vibration. TMS2010, Feb 14-18, 2010, Seattle, WA, USA.
Fengjiang Wang, Matthew O’Keefe. Effect of Surface Finish, Package Size, and Rework on Pb-free Solder Ball Grid Arrays during Thermal Cycling. TMS2009, Feb 15-19, San Francisco, CA, USA.
Fengjiang Wang, Matthew O’Keefe. Numerical and Experimental Analysis of Ball Grid Array Packages during Random Vibration. TMS2008, Mar 9-13, New Orleans, LA, USA.
Matthew O’Keefe, Fengjiang Wang and Brandon Brinkmeyer. Effect of Incorporating Eutectic Sn-Pb Solder on the Microstructure and Tensile Properties of SAC 305 Pb-free Solder. 2008 International Materials Research Conference, June, 9-12, 2008, Chongqing, China.
H.Q. Wang,F.J. Wang, X. Ma, J. Liu and Y.Y. Qian. Study on reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate. The 6th International Conference on Electronics Packaging Technology, August 31-September 1, 2005, Shenzhen, China.
Fengjiang Wang, Xin Ma and Yiyu Qian. Indentation rate-dependent creep behavior of Sn-Ag-Cu Pb-free Ball Grid Array (BGA) solder joint. IPC/Soldertec 2nd international conference on lead-free electronics, June 22-23, 2004, Amsterdam, Netherlands.
F.J. Wang, X. Ma, Y.Y. Qian and F. Yoshida. A study on intermetallic compound layer development at Pb-free solder/Cu joint interfaces. Proceeding of the International Conference on Designing of Interfacial Structures in Advanced Materials and their Joints, Osaka Japan, 2002: 478-483.
王凤江,钱乙余.无铅钎料/Cu界面间金属学行为研究.钎焊及特种连接会议论文集, 2002
专利
王凤江. 一种用于减少锡铋焊点金属间化合物形成的方法. 国家发明专利, 201610592181.0
王凤江. 一种凸点下金属化层构件及制备方法. 国家发明专利, 201610953957.7
吴建雄, 吴建新, 马鑫, 王凤江. 具有抗氧化能力的无铅焊料. 国家发明专利, 专利号ZL 03 1 10895.4
吴建雄, 吴建新, 王凤江, 刘军, 王宏芹. 波峰焊用无铅软钎焊料合金. 国家发明专利, 专利号ZL 03 1 11446.6